Comparison ledger
Accretech UF 3000 LX Automatic Wafer, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 3000 LX Automatic WaferAccretech | |
|---|---|---|
| OEM | Accretech | Tenney |
| Category | Test & Probe | Test & Probe |
| Wafer size | Wafer I.D Reading | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 3000 | Tenney , TPS JR-A-F4T Junior compact temperature test chambers |
| Specifications | ||
| Configuration | Room/hot chuck[1] | — |
| Wafer size | Wafer I.D Reading[2] | — |
| OEM | Accretech / TSK[1] | — |
| Model | UF 3000 LX[1] | JR-A-F4T[4] |
| Equipment type | Automatic Wafer Prober[1] | — |
| Category | Test & Probe[3] | — |
| Wafer I.D Reading | Wafer I.D Reading[3] | — |
| Probe Pad Auto Alignment | Probe Pad Auto Alignment[3] | — |
| Probe Mark Inspection | Probe Mark Inspection[2] | — |
| Needle Cleaning Unit | Needle Cleaning Unit[2] | — |
| Special function | Accepting 25 slot cassette[2] | — |
| GP-IB I/F | GP-IB I/F[2] | — |
| Test Head Check Function | Needle align interlock[2] | — |
| SAPC | SAPC[2] | — |
| Dual Temp | Room ~ Hot[2] | — |
| Motorized Test Head docking Kit | For ND4[2] | — |
| Room/hot chuck | Room/hot chuck[1] | — |
| V93K docking | V93K docking[1] | — |
| Chamber Size | — | 1.2 cubic feet[4] |
| Temperature Range | — | -68°C to +180°C[4] |
| Control | — | +/-1.0°C[4] |
| Manufacturer | — | Tenney[4] |
| Short description | — | Junior compact temperature test chambers[4] |
| Control accuracy | — | +/-1.0°C[4] |
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