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Comparison ledger

W GM 4200 E Edgeversus18 D Surface

Accretech W GM 4200 E Edge, Blanchard 18 D Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMAccretechBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech W GM 4200 E EdgeBlanchard 18 D Surface
Specifications
Wafer typePSiC[1]—
ConfigurationGrinding speed:[1]—
Grinding speed6mm/sec[1]—
Loader unit typeCassette carrier 8": Entegris XT 203-0510 & 6": Entegris PA 182-60 MB-61 C 02)[1]—
Number of cassettes4 load ports with barcode reader[1]—
OEMAccretech / TSK[1]—
ModelW GM 4200 E[1]18 D[4]
Equipment typeEdge Grinder[2]—
Wafer sizes2 inch, 6 inch[1]—
Grinding throughput24 wafers/h in 6"; 8 wafers/h in 8"[1]—
Load ports4 load ports with barcode reader[1]—
CategoryDicing & Grinding[2]—
Voltage—416 V[3]
Phase—3 Phase[3]
Cycles—50[3]
Control Voltage—110[3]
Make—Blanchard[4]
Asset #—153970[3]
Power—416 V, 3 phase[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing
  5. [5]Equipment inventory listing