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Comparison ledger

W GM 4200 E Edgeversus20 36 Surface

Accretech W GM 4200 E Edge, Blanchard 20 36 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMAccretechBlanchard
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech W GM 4200 E EdgeBlanchard 20 36 Surface
Specifications
Wafer typePSiC[1]—
ConfigurationGrinding speed:[1]With new Elecro-Matic Neutrol II Magnetic Chuck Control[3]
Grinding speed6mm/sec[1]—
Loader unit typeCassette carrier 8": Entegris XT 203-0510 & 6": Entegris PA 182-60 MB-61 C 02)[1]—
Number of cassettes4 load ports with barcode reader[1]—
OEMAccretech / TSK[1]—
ModelW GM 4200 E[1]—
Equipment typeEdge Grinder[2]—
Wafer sizes2 inch, 6 inch[1]—
Grinding throughput24 wafers/h in 6"; 8 wafers/h in 8"[1]—
Load ports4 load ports with barcode reader[1]—
CategoryDicing & Grinding[2]—
Magnetic Chuck Control—Electro-Matic Neutrol II[3]
Type—surface grinder[3]
Application—dicing and grinding[4]
Magnetic chuck control—Electro-Matic Neutrol II Magnetic Chuck Control[4]
Condition note—low hours[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com