Comparison ledger
Accretech W GM 4200 E Edge, Disco 3220, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | W GM 4200 E EdgeAccretech | 3220Disco |
|---|---|---|
| OEM | Accretech | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech W GM 4200 E Edge | Disco 3220 |
| Specifications | ||
| Wafer type | PSiC[1] | — |
| Configuration | Grinding speed:[1] | — |
| Grinding speed | 6mm/sec[1] | — |
| Loader unit type | Cassette carrier 8": Entegris XT 203-0510 & 6": Entegris PA 182-60 MB-61 C 02)[1] | — |
| Number of cassettes | 4 load ports with barcode reader[1] | — |
| OEM | Accretech / TSK[1] | — |
| Model | W GM 4200 E[1] | — |
| Equipment type | Edge Grinder[2] | — |
| Wafer sizes | 2 inch, 6 inch[1] | — |
| Grinding throughput | 24 wafers/h in 6"; 8 wafers/h in 8"[1] | — |
| Load ports | 4 load ports with barcode reader[1] | — |
| Category | Dicing & Grinding[2] | — |
| equipment type | — | dicing saw[3] |
| Workplace size | — | ø150 mm[4] |
| Spindle layout | — | Single[4] |
| Spindle output | — | 1.5 kW at 30,000 min-1[4] |
| Spindle max revolution speed | — | 40,000 min-1[4] |
| X-axis feed speed range | — | 0.1 – 500 mm/s[4] |
| Y-axis index step | — | 0.0001 mm[4] |
| Z-axis repeating accuracy | — | 0.001 mm[4] |
| Z-axis max blade size | — | ø58 mm[4] |
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