Comparison ledger
AJA A300-XP, Applied Materials 0020 17485 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | A300-XPAJA | 0020 17485 PartApplied Materials |
|---|---|---|
| OEM | AJA | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | AJA A300-XP | Applied Materials 0020 17485 Part |
| Cited variants | — | |
| Specifications | ||
| Source family | A300-XP UHV magnetron sputtering sources[1] | — |
| Description | Next generation, "expanded performance" version of the A300 series[1] | — |
| Stated improvements | Higher pressure operation, improved magnetic material sputtering performance, and a larger product range[1] | — |
| Variant examples mentioned | A320-XP, A330-XP, A340-XP[1] | — |
| A330-XP substrate orientation example | Con-focal orientation for uniform deposition onto 150 mm diameter substrates[1] | — |
| Type | UHV Magnetron Sputtering Source[1] | — |
| Target Diameters (circular) | 2" (A320-XP), 3" (A330-XP), 4" (A340-XP)[1] | — |
| Miniature Source Target Diameter | Fits through 2.75" CF flange, up to 2" substrate Ø[1] | — |
| Operating Pressure Range | 0.3 mTorr – 1.0 Torr[1] | — |
| Compatibility | RF and DC operation[1] | — |
| Key Features | Modular magnet array isolated from cooling water, integral gas injection and chimney, efficient target cooling with no vacuum/water seals, clamped target mounting, in-situ tilt option[1] | — |
| Configuration | — | Strap, RF Out 2 Balanced Coil Match, Hdp[2] |
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