Waferpedia

Comparison ledger

0010-03254 E Chuckversus320

Applied Materials 0010-03254 E Chuck, STS 320, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
320STS
OEMApplied MaterialsSTS
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—STS 320
Cited variants—
Specifications
Reactive Ion Etch Type—Parallel-plate RIE[1]
RF Frequency—13.56 MHz[1]
Driven Electrode Area—900 cm²[1]
Process Gases—SF6, SF6+O2, CF4, CF4+O2[1]
Pressure (typical)—55 mtorr[1]
OEM—Surface Technology Systems[1]
Tool type—parallel-plate RIE tool[1]
Driven electrode area—about 900 cm2[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]nanocenter.umd.edunanocenter.umd.edu