Comparison ledger
Applied Materials 0010-03254 E Chuck, Tokyo Electron Act 12, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | Act 12Tokyo Electron |
|---|---|---|
| OEM | Applied Materials | Tokyo Electron |
| Category | — | — |
| Wafer size | — | Single-pincette shared wafer transfer with centering guides |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Tokyo Electron Act 12 |
| Specifications | ||
| Configuration | — | 2Coater 2B.L.Cot 4Developer[1] |
| Wafer Size | — | 8 inch[5] |
| Vintage | — | 2003 |
| Coaters & Developers Vintage | — | 2002 |
| Number of Coater Modules | — | 2[1] |
| Number of Bottom-Layer Coat Modules | — | 2[1] |
| Number of Developer Modules | — | 4[1] |
| Direction | — | LEFT HAND SIDE |
| 3 Blocks Interfaced | — | Foup-Process Block-Scanner Interface |
| 3 Wafer Transfer Robot Arms | — | Foup-Process Block-Scanner Interface |
| Wafer size | — | Single-pincette shared wafer transfer with centering guides |
| ➢ Note | — | Exclude HDD OEM Model Description |