Comparison ledger
Applied Materials 0010-03485 Magnet Assy, YES 199, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | 199YES |
|---|---|---|
| OEM | Applied Materials | YES |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | YES 199 |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | — |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Document topic | — | Processing procedures for BCB adhesion[5] |
| Material family | — | Cyclotene Advanced Electronic Resins / benzocyclobutene (BCB)[5] |
| Adhesion promoters discussed | — | AP3000 and AP8000[5] |
| Recommended adhesion promoters | — | AP3000 and AP8000 are the only adhesion promoters recommended for use with BCB[5] |
| Recommended pre-clean | — | O2 plasma, with or without water rinse[5] |
| Preferred plasma tool type | — | RIE-type plasma tools[5] |
| Adhesion test methods | — | Tape peel, modified edge lift-off (m-ELT), and bump shear[5] |
| Tape peel standard | — | ASTM D-3359-93[5] |
| Pressure cooker test conditions | — | 121°C, 2 atmospheres pressure, 100% relative humidity[5] |
| Thickness example | — | BCB bump shear squares are typically 100 μm x 100 μm[5] |