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Comparison ledger

0010-13622 RF Match forversusCentura 5200 WXZ

Applied Materials 0010-13622 RF Match for, Applied Materials Centura 5200 WXZ, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
Centura 5200 WXZApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forApplied Materials Centura 5200
Cited variants—
  • Centura 5200 WXZ Metal[1]
  • Centura 5200 WXZ Metal CVD[1]
  • Centura 5200 WxZ / Sprint W[2]
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[3]Parts Machine[4]
Model0010-13622[3]Centura 5200 WXZ[4]
Product TypeRF Match for PVD (Physical Vapor Deposition)[3]—
FeatureHigh Efficiency HE RF Match-Bias[3]—
Chamber—1[6]
OEM—Applied Materials[4]
Category—Deposition[4]
Wafer size—8 inch[4]
Process type—Metal CVD (Chemical Vapor Deposition)[2]
Chambers—3 Chambers[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]macquarie.commacquarie.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]inventory listing
  6. [6]inventory listing