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Comparison ledger

0010-13622 RF Match forversusCentura Giga-Fill

Applied Materials 0010-13622 RF Match for, Applied Materials Centura Giga-Fill, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
Centura Giga-FillApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forApplied Materials Centura Giga-Fill
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]—
Model0010-13622[1]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
Wafer Size—200 mm (8 inch)[2]
Process—Sub-atmospheric CVD (SACVD) of BPSG[3]
Tool Configuration—Cluster tool[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com