Applied Materials
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Applied Materials Centura Giga-Fill is a chemical vapor deposition (CVD) cluster tool for processing 200 mm wafers. The Centura Giga-Fill is specifically designed for sub-atmospheric CVD (SACVD) of borophosphosilicate glass (BPSG).[1][2][3]

The Applied Materials Centura Giga-Fill is a chemical vapor deposition cluster tool used for semiconductor deposition.[1][2][3]
A chemical vapor deposition system forms thin films by delivering process gases into a reaction chamber where they decompose or react on the wafer surface. A cluster tool architecture groups processing chambers around a central handling platform so wafers can move between steps with reduced exposure to ambient air.
The Centura Giga-Fill sits in the wafer deposition segment of the fab flow, where dielectric or other film layers are added after earlier front-end patterning steps and before later planarization or subsequent integration steps.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the Centura Giga-Fill are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura Giga-Fill are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura Giga-Fill are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura Giga-Fill are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura Giga-Fill are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura Giga-Fill is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 20, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.