Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Centura I P 2 DPS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Centura I P 2 DPSApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Centura |
| Cited variants | — | |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[4] | R1 Metal 2CH ASP+ 2CH[1] |
| Model | 0010-13622[4] | Centura I P 2[1] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[4] | — |
| Feature | High Efficiency HE RF Match-Bias[4] | — |
| OEM | — | Applied Materials[3] |
| Full designation | — | Applied Materials Centura I P 2 DPS (Decoupled Plasma Source)[3] |
| Category | — | Deposition[3] |
| Wafer size | — | 8 inch[3] |
| Process description | — | R1 Metal 2CH ASP+ 2CH[3] |
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