Comparison ledger
Applied Materials 0010-13622 RF Match for, CHA SE-1000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | SE-1000CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | 10 in. |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | CHA SE-1000 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| System type | — | Sputtering System[2] |
| Wafer size | — | 10 in.[2] |
| System size | — | 10-inch system[2] |
| Deposition type | — | High vacuum deposition system[3] |
| Bell jar diameter | — | 25.5 in., water-cooled[3] |
| Baseplate diameter | — | 26 in. stainless steel[3] |
| Wafer capacity | — | Up to thirty six 4-inch wafers[3] |
| Diffusion pump | — | 10-inch diffusion pump rated at 5300 l/s[4] |
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