CHA
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Plate 01CHA SE 1000 Inv# 57367
Wafer size
10 in.
Vacuum
High vacuum deposition system[3]
The CHA SE-1000 offers lift-off fixturing as a popular option. The CHA SE-1000 also supports commercially available sources including single-beam and multiple-beam configurations as well as resistance and sputtering sources.[3]
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The CHA SE-1000 is typically equipped with a 25.5-inch diameter water-cooled bell jar and a 26-inch diameter stainless steel baseplate.[3][4]
The CHA SE-1000 is specified with an ultimate vacuum in the 10-8 torr range.[3]
The following facts about the SE-1000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE-1000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SE-1000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE-1000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SE-1000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SE-1000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 17, 2026.
The CHA SSC-1000 is a multi-station sputtering system configured with up to four RF or DC cathodes.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.