Comparison ledger
Applied Materials 0010-13622 RF Match for, CHA SE-600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | SE-600CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | 6 in. |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | CHA SE-600 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Equipment type | — | Sputtering System[2] |
| Wafer size | — | 6 in.[2] |
| System class | — | High Vacuum Deposition Systems[3] |
| Bell jar diameter | — | 19.5 in.[3] |
| Planetary fixturing capacity | — | 18 4-inch wafers[3] |
| Average pumpdown time | — | Less than 30 minutes[3] |
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