Comparison ledger
Applied Materials 0010-13622 RF Match for, Ultron UH 108 Wafer Film Applicator, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Ultron |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Ultron UH 108 Wafer Film Applicator |
| Cited variants | — | |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[2] | 1 amps[3] |
| Model | 0010-13622[2] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[2] | — |
| Feature | High Efficiency HE RF Match-Bias[2] | — |
| Voltage | — | 115 Vac[3] |
| Phase | — | 1 Phase[3] |
| Electrical requirements | — | 1 amp, 115 Vac, single-phase, 50/60 Hz[4] |
| Wafer capability options | — | 5" wafer capability; 6" wafer capability; 8" and 12" wafer capability[1] |
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