Ultron
UH 108 Wafer Film Applicator
What it is
General reference — not yet source-verifiedA wafer film applicator is a bench tool used to laminate protective film onto a wafer surface. Wafer film applicators are used where a wafer needs temporary surface protection during later handling or mechanical processing. Wafer film applicators belong to wafer preparation and handling operations rather than chamber-based thin-film deposition.
How it works
The UH108 Series uses an adjustable spring-loaded roller assembly for lamination. The UH108 Series uses a vacuum-securing wafer stage and a wafer-centering mechanism. The UH108 Series has adjustable alignment pins and an adjustable cutter assembly. The UH108 Series can perform either a contact cut for wafers with alignment flats or a non-contact cut for wafers with an alignment notch. The UH108 Series cuts film to the edge of the wafer, including flats, within 0.005 inch in less than 20 seconds. The UH108 Series operates with backed or non-backed film. The UH108 Series also offers an optional take-up roller assembly for film with a backed liner. The UH108 Series offers an optional static eliminator.[3]
Where it fits in the process flow
The UH108 Series is intended for frontside protection tape application in wafer backlapping use. The UH108-8 offers 5 inch and 6 inch wafer capability. The UH108-12 offers 8 inch and 12 inch wafer capability.[3]
Applications
The UH108 Series is used for frontside protection tape application. The UH108 Series is designed to provide bubble-free lamination to wafers. The UH108 Series can accommodate different film requirements and various wafer thicknesses.[3]
What do the numbers mean?
Power & electrical4
Wafer handling1
- Wafer capability options
- 5" wafer capability; 6" wafer capability; 8" and 12" wafer capability[3]
Configuration & options1
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does the UH108 Series handle film lamination and trimming?
The UH108 Series uses an adjustable spring-loaded roller assembly for lamination. The UH108 Series uses a vacuum-securing wafer stage and a wafer-centering mechanism. The UH108 Series cuts film to the edge of the wafer, including flats, within 0.005 inch in less than 20 seconds.[3]
Not publicly documented
The following facts about the UH 108 Wafer Film Applicator are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UH 108 Wafer Film Applicator are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the UH 108 Wafer Film Applicator are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UH 108 Wafer Film Applicator are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UH 108 Wafer Film Applicator is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the UH 108 Wafer Film Applicator are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.comwaferpedia.com
- [3]ultronsystems.com — ultronsystems.comultronsystems.com
Last updated Oct 19, 2026.
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