Comparison ledger
Applied Materials 0010-13627 High Efficiency RF Match, Semitool Raider ECD 312 Electroplating, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13627 High Efficiency RF MatchApplied Materials | Raider ECD 312 ElectroplatingSemitool |
|---|---|---|
| OEM | Applied Materials | Semitool |
| Category | Lab & Support Equipment | Lab & Support Equipment |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13627 High Efficiency RF Match | Semitool Raider ECD |
| Specifications | ||
| Configuration | HE, BIAS[1] | 50/60 Hz[3] |
| Asset Number | 70430[2] | — |
| Type | High Efficiency RF Match - HE, BIAS[2] | — |
| OEM | Applied Materials[2] | — |
| Model | 0010-13627[2] | — |
| Phase | — | 3 Phase[3] |
| Voltage | — | 380 V[4] |
| Loadport | — | 3 X FOUP[3] |
| PC | — | FUI[3] |
| Power Phase | — | 3 Phase[3] |
| Frequency | — | 50/60 Hz[4] |
| Wafer Handling Robot | — | Xfer Robot, 1x Linear Dual Arm with Edge Grip Endeffector[3] |
| Vacuum and Rinse | — | Vacuum prewet, 1 Stack SRD[3] |
| Chemical Tanks | — | 11[3] |
| Chillers | — | 4[3] |
| Controller | — | PC with FUI[3] |
| Chamber Components | — | Chamber lift assy, Spin motor, Push plate control board, Plate sylinder (2), Contact Ring (only ECD), Lip seal (only eCD), Flow pump (only eCD), Anode basket (only eCD)[3] |
| Tank Components | — | Tank body, Circulation pump, Filter housing, Heater housing, Level sensor (5), Tank remote board, Tank control block[3] |
| Vintage | — | 2011[3] |
| Power | — | 3 Phase[4] |
| Vacuum / rinse | — | Vacuum prewet, 1 Stack SRD[4] |
| Wafer handling | — | FOUP loadport handling; transfer robot with linear dual arm and edge grip end effector[4] |
| Gas / chemistry | — | Chemical tank (11)[4] |
| Chiller | — | 4[3] |
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