Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Lam Research 9400, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | 9400Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Lam Research 9400 |
| Specifications | ||
| OEM | Applied Materials[1] | Lam Research[3] |
| Model | 0010-16392[1] | TCP 9400[3] |
| Type | ESC Assembly[1] | — |
| Wafer Size | 300 mm[2] | — |
| Electrode Configuration | Dual[2] | — |
| Tool name | — | Lam Research TCP 9400 Poly Etcher[3] |
| Process category | — | Inductively Coupled Plasma Etching (ICP)[3] |
| Cleanliness group | — | Clean, Semiclean[3] |
| Use | — | for poly and Si etches[3] |
| Maximum etch depth | — | 3 um[3] |
| Process materials | — | Poly and Si[3] |
| Cleanliness | — | Clean, Semiclean[3] |
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