Lam Research

9400

Research Quality: 30% complete

Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

Plate 01#Brooks robot Lam research 9400 9600 etcher VTM robot overhaul exchange repair
wafer robot repair overhaul Brooks Kawasaki rorzeWatch on YouTube

What is it?

The sources list Lam Research TCP 9400 as an inductively coupled plasma etch system. It is described as a clean-category tool used for poly and silicon etches, with a maximum etch depth of 3 um.

What can it run?

Process applications and technology nodes documented for this tool.

poly etches
silicon etches

What do the numbers mean?

Dimensions & facilities1

Maximum etch depth: 3 um^[1]

Configuration & options6

OEM: Lam Research^[1]
Model: TCP 9400^[1]
Tool name: Lam Research TCP 9400 Poly Etcher^[1]
Process category: Inductively Coupled Plasma Etching (ICP)^[1]
Cleanliness group: Clean, Semiclean^[1]
Use: for poly and Si etches^[1]

Interested in this tool?

Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 9400 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9400 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 9400 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 9400 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 9400 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 9400 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]snfguide.stanford.edu — snfguide.stanford.edusnfguide.stanford.edu
[2]Inductively Coupled Plasma Etching (ICP) | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu
[3]Dry Etching | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu