Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusBondjet LSB959

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Hesse & Knipps Bondjet LSB959, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
Bondjet LSB959Hesse & Knipps
OEMApplied MaterialsHesse & Knipps
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedHesse & Knipps Bondjet LSB959
Specifications
ConfigurationRefurbished[1]—
Machine type—Fully automatic heavy wire bonder[2]
Function—Thermosonic function[2]
Product line—Bondjet[2]
Laser source—IR fiber laser[3]
Laser power—Up to 130 W[3]
Bondtool tip temperature—400-500 °C[3]
Interface temperature—150-200 °C[3]
Frequency—60 kHz[3]
Wire diameter—Cu: 300 μm – 500 μm[3]
Working area X—370 mm[3]
Working area Y—560 mm[3]
Working area Z—42 mm[3]
P-rotation—440°[3]
Footprint—805 x 1634 x 1912 mm[3]
Weight—ca. 1300 kg[3]
Power supply—230V AC[3]
Connectivity—Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air, vacuum, process gas[3]
Operation modes—Fully automatic or manual[3]
Process modes—Classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[3]
Laser safety class—Laser class 1[3]
Type—Fully automatic heavy wire bonder[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]hesse-mechatronics.comhesse-mechatronics.com
  3. [3]hesse-mechatronics.comhesse-mechatronics.com