Bondjet LSB959

The Hesse & Knipps Bondjet LSB959 is a lasersonic wire bonder. The Bondjet LSB959 is a fully automatic heavy wire bonder with thermosonic function. The Bondjet LSB959 can process large-sized substrates, chips, and other materials. The Bondjet LSB959 can be used as a fully automatic machine or operated manually. The Bondjet LSB959 supports classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding on one platform.^[1][2][3]

The Bondjet LSB959 adds thermal energy to the welding process by using a laser to heat the bond tool. The Bondjet LSB959 uses precise temperature control at the tip of the bond tool. The thermosonic heavy wire bondhead uses a laser-heated bondtool tip with controlled laser absorption. The thermosonic bondhead is specified at 60 kHz, with alternative frequencies on request. The bondtool tip is specified at 400-500 °C for an interface at 150-200 °C. The system uses an IR fiber laser with power up to 130 W. The Bondjet LSB959 offers active and passive cutting methods. The Bondjet LSB959 provides continuous real time monitoring of wire deformation, transducer current, frequency, and bond tool temperature within programmable control limits. The Bondjet LSB959 can include Process integrated Quality Control and an integrated non-destructive pulltest.^[2][3]

Wire bonding sits in semiconductor and electronics assembly after the substrate, die, or power device has already been fabricated and mounted in an assembly. A heavy wire bonder is used when the package or module needs interconnects between chips, substrates, terminals, or other conductive features. Bonding is typically followed by later packaging, protection, test, or higher-level module assembly steps depending on the product form.

Heavy wire bonders are used in power-oriented electronic packaging where robust interconnects are needed between substrates, semiconductor devices, and external connection points. Machines in this class are common in power semiconductor packaging, module assembly, and related electronic interconnect work. Thermosonic heavy wire bonding is used where added local heat can support bonding on difficult material combinations while limiting heat exposure in surrounding areas.