Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Hesse & Knipps BJ 855, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | BJ 855Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | Hesse & Knipps (H&K) BJ 855 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Refurbished[2] | 60° Bondhead[3] |
| Model | — | BJ 855[3] |
| Type | — | Wire Bonder[3] |
| Bonding type | — | High Speed Fully Automatic Fine Wire Bonder[1] |
| Bondhead types | — | Wedge-wedge and ball-wedge[1] |
| Working area | — | 305 mm x 410 mm x 19 mm[1] |
| Working area X/Y | — | X: 305 mm; Y: 410 mm[4] |
| Z stroke | — | 32 mm[4] |
| P rotation | — | 440°[4] |
| Speed | — | Up to 7 wires per second[1] |
| Wire size | — | Al, Au, Ag, Pt: 12.5 µm to 75 µm[1] |
| Ribbon size | — | Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm[1] |
| Wire feed angles | — | 45°, 60°, 90°[1] |
| Footprint | — | 740 mm x 1484 mm x 1912 mm[1] |
| Weight | — | ca. 1150 kg[1] |
| Power supply | — | 230V AC[1] |
| Media connectivity | — | Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air (CDA clean, dry air), vacuum[1] |
| Applications | — | HF and RF technology, COB, MCM, hybrids, optical, and automotive electronics[1] |
| Bonder type | — | High speed fully automatic fine wire bonder (wedge-wedge and ball-wedge)[1] |
| Working area X | — | 305 mm[1] |
| Working area Y | — | 410 mm[1] |
| Working area Z | — | 19 mm (source 2); 32 mm Z stroke (source 3); 30 mm Z (source 5)[1] |
| Bond speed | — | Up to 7 wires per second, depending on application and bondhead, e.g. wedge-wedge bondhead, 25 μm wire, 1 mm loop length, metallized wafer[1] |
| Wire materials and diameters | — | Al, Au, Ag, Pt: 12.5 µm – 75 µm (0.5 mil – 3 mil); Cu: 12.5 µm – 50 µm (0.5 mil – 2 mil); source 5 adds Ni and Cu variation: Al, Au, Ag, Cu, Pt, Ni: 12.5 μm – 75 μm[1] |
| Ribbon sizes | — | Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm (1.4 mil x 0.25 mil up to 10 mil x 1 mil)[1] |
| Fine pitch (wedge-wedge) | — | 40 µm inline, 25 µm staggered/dual line[1] |
| Frequency (wedge-wedge) | — | 100 kHz (source 5); alternative frequencies available on request[5] |
| Dimensions (W x D x H) | — | 740 mm x 1484 mm x 1912 mm (sources 2, 3, 4); 740 mm x 1484 mm x 1910 mm (source 5)[1] |
| Automation and interfaces | — | Digital IOs, SMEMA connection, Profibus support, SECS/GEM, MES interface, TwinCAT automation[4] |
| Touchdown detection | — | High precision touchdown detection without time delay[1] |
| Ultrasonic generator | — | Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution[1] |
| Quality monitoring | — | Continuous real time monitoring of wire deformation, transducer current, frequency and impedance; optional PiQC process integrated quality control with additional sensor system[1] |
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