Hesse & Knipps
BJ 855
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The BJ 855 is a Hesse & Knipps wire bonder. The BJ 855 is a high-speed fully automatic fine wire bonder. The BJ 855 uses wedge-wedge and ball-wedge bondheads.[1][2]
What it is
How it works
The BJ 855 uses pattern recognition, bondforce calibration, wire deformation monitoring, and ultrasonic or thermosonic bonding functions to place and connect bonds with controlled geometry. The machine also supports automation interfaces and line-management functions for integration into production cells.[1][2][5]
Where it fits in the process flow
Applications
The BJ 855 is used for components in HF and RF technology, chip-on-board assemblies, multichip modules, hybrids, optical electronics, and automotive electronics.[1][2][5]
The BJ 855 supports wire materials including Al, Au, Ag, Cu, Pt, and Ni, and it supports ribbon bonding with Al and Au ribbon.[1][2][5][6]
What do the numbers mean?
Power & electrical6
- Media connectivity
- Compressed air, vacuum, 16A/230V AC, digital IOs, USB ports, SMEMA connection, Gigabit Ethernet (TCP/IP), Profibus support[2]
- Applications
- HF and RF technology, COB, MCM, hybrids, optical, and automotive electronics[1]
- Ultrasonic generator
- Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution[1]
Vacuum & pumping2
Wafer handling1
- Bond speed
- Up to 7 wires per second, depending on application and bondhead, e.g. wedge-wedge bondhead, 25 μm wire, 1 mm loop length, metallized wafer[1]
Performance1
Control & software2
- Automation and interfaces
- Digital IOs, SMEMA connection, Profibus support, SECS/GEM, MES interface, TwinCAT automation[2]
- Quality monitoring
- Continuous real time monitoring of wire deformation, transducer current, frequency and impedance; optional PiQC process integrated quality control with additional sensor system[1]
Dimensions & facilities4
- Dimensions (W x D x H)
- 740 mm x 1484 mm x 1912 mm (sources 2, 3, 4); 740 mm x 1484 mm x 1910 mm (source 5)[1]
Configuration & options22
- 60° Bondhead[4]
- Wire materials and diameters
- Al, Au, Ag, Pt: 12.5 µm – 75 µm (0.5 mil – 3 mil); Cu: 12.5 µm – 50 µm (0.5 mil – 2 mil); source 5 adds Ni and Cu variation: Al, Au, Ag, Cu, Pt, Ni: 12.5 μm – 75 μm[1]
- Ribbon sizes
- Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm (1.4 mil x 0.25 mil up to 10 mil x 1 mil)[1]
- Bondhead types
- Wedge-wedge bondheads with wire feed angle 45°, 60°, 90° (deep access for ribbon or wire); mechatronic ball-wedge bondheads with 11/19 mm capillaries[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| BJ885 | — | — | Sibling model in the Bondjet BJ855/BJ885 family; working area X: 370 mm, Y: 870 mm, Z: 19 mm; dimensions 880 x 1780 x 1912 mm; weight approx. 1800 kg | hesse-mechatronics.com[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power supply230V AC[1]
- Media connectivityGigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air (CDA clean, dry air), vacuum[1]
- Media connectivityCompressed air, vacuum, 16A/230V AC, digital IOs, USB ports, SMEMA connection, Gigabit Ethernet (TCP/IP), Profibus support[2]
- ApplicationsHF and RF technology, COB, MCM, hybrids, optical, and automotive electronics[1]
- Frequency (wedge-wedge)100 kHz (source 5); alternative frequencies available on request[5]
- Power supply230V AC (sources 2, 3, 4); 16A/230V AC (source 3); 16A AC (source 5)[1]
- Media connectivityCompressed air (CDA clean, dry air), vacuum, Gigabit-Ethernet (TCP/IP), USB ports, HDMI ports[1]
- Ultrasonic generatorDigital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of wire can be used with this class of machine?General reference — not yet source-verified
Gold, copper, aluminum, and other conductive wire types may be used, depending on the process requirements and the machine configuration.
What is the difference between ball bonding and wedge bonding?General reference — not yet source-verified
Ball bonding uses a capillary to form a sphere at the wire tip for the first bond; wedge bonding uses a wedge tool and ultrasonic energy, and is often used for aluminum wire.
What factors affect bond quality?General reference — not yet source-verified
Bond quality depends on tool condition, wire feed, bonding parameters such as force, time, ultrasonic power, and surface cleanliness of the bond pads.
Is this machine suitable for high-volume production?General reference — not yet source-verified
Wire bonders of this class are generally designed for automated, repeatable operation and can be integrated into high-volume assembly lines, subject to cycle time and configuration.
What maintenance is typical for such systems?General reference — not yet source-verified
Routine maintenance includes cleaning or replacing bonding tools, checking wire clamps and cutters, calibrating bond force and ultrasonic transducers, and periodically verifying bond strength.
Not publicly documented
The following facts about the BJ 855 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BJ 855 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the BJ 855 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BJ 855 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BJ 855 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the BJ 855 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]hesse-mechatronics.com — hesse-mechatronics.comhesse-mechatronics.com
- [2]hesse-mechatronics.com — hesse-mechatronics.comhesse-mechatronics.com
- [3]Inventory photo
- [4]inventory listing
- [5]accelonix.nl — accelonix.nlaccelonix.nl
- [6]Bondjet BJ855 - Hesse GmbH | Wire Bonder — semiconductor.directorysemiconductor.directory
Last updated Oct 13, 2026.
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