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0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusBondjet BJ 820 Rotary Bond Head

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Hesse & Knipps Bondjet BJ 820 Rotary Bond Head, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsHesse & Knipps
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedHesse & Knipps (H&K) Bondjet BJ 820 Rotary Bond Head
Specifications
ConfigurationRefurbished[1]for RF360 EPCOS[2]
OEM—Hesse & Knipps (H&K)[2]
Model—Bondjet BJ 820[2]
Type—Rotary bond head[3]
Category—Packaging & Bonding[3]
Configuration / option—For RF360 EPCOS[3]
Bonding modes—Round wire and deep access ribbon and wire bonding[4]
Reported speed—Up to 7 wires/sec[4]
Work area—12 in x 16.1 in[4]
Footprint—720 x 1250 mm[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]circuitsassembly.comcircuitsassembly.com