Hesse & Knipps
Bondjet BJ 820 Rotary Bond Head
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
How it works
The Bondjet BJ 820 uses piezo bondheads and offers precise bondforce control in static and dynamic modes. The Bondjet BJ 820 provides high precision touchdown detection without time delay. The Bondjet BJ 820 monitors wire deformation, transducer current, frequency, and impedance in real time within programmable control limits. The Bondjet BJ 820 supports an E-Box for programmable alignment marks for the wedge and wire clamp. The Bondjet BJ 820 offers manual and fully automated operation.[4]
What do the numbers mean?
Dimensions & facilities1
Configuration & options9
- for RF360 EPCOS[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Bondjet BJ 820 Rotary Bond Head are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Bondjet BJ 820 Rotary Bond Head are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Bondjet BJ 820 Rotary Bond Head are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Bondjet BJ 820 Rotary Bond Head are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Bondjet BJ 820 Rotary Bond Head are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Bondjet BJ 820 Rotary Bond Head is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.comwaferpedia.com
- [3]circuitsassembly.comcircuitsassembly.com
- [4]https://accelonix.nl/wp-content/uploads/bros-mk-bondjet-bj820-en-20160901.pdf — accelonix.nlaccelonix.nl
Last updated Oct 19, 2026.
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