Comparison ledger
Applied Materials 0010 47763, Applied Materials Enabler, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | EnablerApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2010 Vintage |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials Enabler |
| Cited variants | — | |
| Specifications | ||
| Configuration | 2nd Source New[3] | — |
| Type | Monopolar Dual Heated[4] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[5] | Dielectric etcher[1] |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4] | — |
| Model | 0010-47763[3] | Enabler[6] |
| OEM | Applied Materials[3] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[4] | — |
| Quantity available (source) | 1[4] | — |
| Manufacturer | — | Applied Materials[6] |
| Category | — | Etcher[6] |
| Wafer size | — | 12 inch[6] |
| Process chambers | — | 4[1] |
| Version | — | 300 mm[1] |
| Configured wafer size | — | 300 mm[7] |
| Process | — | OX[7] |
| Software revision | — | B2.8_79[7] |
| FI software | — | FB4.70_12[7] |
| GEM software | — | 7.20_17[7] |
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