0010 47763

Electrostatic chucks are wafer-holding components used inside vacuum process chambers. Electrostatic chucks belong to the support hardware of plasma process equipment rather than to metrology or handling systems. Electrostatic chucks provide wafer retention while the process chamber carries out a deposition or etch step.

Electrostatic chucks hold wafers by applying an electric field through a dielectric surface. Electrostatic chucks commonly combine clamping with thermal control so the wafer remains both secured and temperature managed during plasma processing. Bonded ESC assemblies generally integrate ceramic, electrode, heater, and backing structure into a chamber-facing support component.

In fab process flow, electrostatic chucks sit inside chamber modules where wafers must be held flat and stable during vacuum processing. Electrostatic chucks are used after wafer loading into a process module and before wafer unloading from that module. Electrostatic chucks support chamber steps in which thermal uniformity, backside gas coupling, and nonmechanical clamping are important to process control.

The Applied Materials 0010 47763 is used to hold wafers in place during semiconductor manufacturing. The Applied Materials 0010 47763 is mainly used in etching equipment. The Applied Materials 0010 47763 is applied to fixing silicon wafers and glass substrates for liquid crystal panels in semiconductor manufacturing processes such as PVD, CVD, and ETCH.^[2][7]