Comparison ledger
Applied Materials 0020 17484 Part, Applied Materials Centura 5200 EPI Reactor, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 17484 PartApplied Materials | Centura 5200 EPI ReactorApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 17484 Part | Applied Materials Centura 5200 |
| Specifications | ||
| Configuration | Bar, Cap Bank, Hdpcvd 300mm Ultima X[1] | 3 atmospheric epi chambers[2] |
| Manufacturer | — | Applied Materials[2] |
| Model | — | Centura 5200 EPI Reactor[2] |
| Category | — | Deposition[3] |
| Tool type | — | epitaxial reactor[3] |
| Atmospheric epi chambers | — | 3[3] |
| Cool-down chamber | — | 1[3] |
| Wafer handling robot | — | HP+ Robot[3] |
| Loadlocks | — | Wide Body Loadlocks[3] |
| Loadlock platform | — | Universal loadlock platform (200mm or 150mm)[3] |
| Power & electrical | — | 208V external transformer[3] |
| Variable speed blower | — | Included[3] |
| Center finder | — | On-The-Fly Center Finder[3] |
| BMV system | — | Accusett BMV system[3] |
| Communications | — | HSMS GEMSECS[3] |
| Dopant supply lines | — | 2 mixed dopant supply lines[3] |
| TCS supply line | — | Included[3] |
| Process kits | — | No process kits included[3] |
| Vintage | — | 2004[3] |
| Wafer size | — | 200mm or 150mm[2] |
| Nickle system | — | Yes[4] |
| Toxic gas box | — | Yes[4] |
| Voltage | — | 208 Volts[4] |
| Flash Memory Dr | — | Yes[4] |
| Processor | — | 68040[4] |
| Load locks | — | WB ENP[4] |
| Robot | — | HP[4] |
| Heat exchanger | — | Steel[4] |
| Chamber A | — | RP Epi[4] |
| Chamber B | — | Rp Epi[4] |
| Chamber C | — | RP Epi[4] |
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