Waferpedia

Comparison ledger

0020 17484 Partversus3290

Applied Materials 0020 17484 Part, Novellus 3290, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0020 17484 PartApplied Materials
3290Novellus
OEMApplied MaterialsNovellus
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17484 PartNovellus 3290
Cited variants—
  • Novellus / Varian 3290 STQ[1]
Specifications
ConfigurationBar, Cap Bank, Hdpcvd 300mm Ultima X[2]ECS 3000 or MST 3000[3]
Process type—PVD sputter physical vapor deposition[3]
Wafer size—6 inch[3]
Configuration options—ECS 3000 or MST 3000[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com