Waferpedia

Comparison ledger

0020 17484 PartversusIC/5

Applied Materials 0020 17484 Part, Temescal IC/5, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0020 17484 PartApplied Materials
IC/5Temescal
OEMApplied MaterialsTemescal
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17484 PartTemescal IC/5
Specifications
ConfigurationBar, Cap Bank, Hdpcvd 300mm Ultima X[1]—
product type—Multi-process deposition controller[2]
application—Deposition controller for e-beam systems[3]
process type—Evaporation and other physical vapor deposition (PVD) processes[3]
software and I/O—Enhanced software and logic I/O features[3]
process storage—Up to 50 processes[2]
layer storage—250 total layers[2]
extended storage—Unlimited with the floppy disk option[2]
data logging—Stores layer and process data in ASCII format for post-run analysis[2]
Description—Provides programmable control over sequential or co-deposition processes plus memory for up to 50 processes[4]
SKU—9401-0235-0[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org
  4. [4]e-beam.ferrotec.come-beam.ferrotec.com