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Comparison ledger

0020 17485 PartversusCV-6SXL

Applied Materials 0020 17485 Part, Temescal CV-6SXL, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
CV-6SXLTemescal
OEMApplied MaterialsTemescal
CategoryDepositionDeposition
Wafer size—5"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartTemescal CV-6SXL
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]—
Manufacturer—Temescal[2]
Model—CV-6SXL[2]
Description—Electron-Beam Evaporation System[2]
Power supply—10 kV[2]
E-beam source—4-pocket Series 260 E-Beam turret source[2]
Controller—TemEbeam Controller (EBC)[2]
Deposition controller—Inficon IC/5 Thin Film Deposition Controller[2]
Vacuum system—Cryo-pumped system with low E-7 ultimate base pressure[2]
Automatic vacuum sequencing—CHA Auto-Tech II[2]
Thickness monitoring—Crystal thickness monitoring[2]
Sample size—Up to 5" diameter non-heated; 4" diameter heated[2]
Heated sample holder—Programmable; sample temps up to 370°C[2]
Oxygen gas MFC—For maintaining oxide stoichiometry[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu