Waferpedia

Comparison ledger

0020 18698 PartversusCentura Giga-Fill

Applied Materials 0020 18698 Part, Applied Materials Centura Giga-Fill, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0020 18698 PartApplied Materials
Centura Giga-FillApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18698 PartApplied Materials Centura Giga-Fill
Specifications
ConfigurationDial Cover, Side Local Match, Hdpcvd, Ul[1]—
Wafer Size—200 mm (8 inch)[2]
Process—Sub-atmospheric CVD (SACVD) of BPSG[3]
Tool Configuration—Cluster tool[3]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com