Comparison ledger
Applied Materials 0020 23839 Part, CHA SE 600 High Vacuum E-Beam Evaporation, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 23839 PartApplied Materials | |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 23839 Part | CHA SE 600 High Vacuum E-Beam Evaporation |
| Specifications | ||
| Configuration | Plate, Sensor Clamp, Hdpcvd Ultima +[1] | 19 in. dia. water cooled bell jar[2] |
| Wafer size | — | 3 in. diameter wafers[2] |
| Bell jar | — | 19 in. dia. water cooled bell jar[2] |
| Wafer fixturing | — | Triple dome planetary fixturing currently configured for 3 in. diam. wafers[2] |
| Deposition rate monitor | — | Inficon IC6000 crystal deposition rate monitor[2] |
| Valve sequencer | — | Automatic valve sequencer[2] |
| E-gun | — | Four pocket E-gun with manual rotation control[2] |
| Power supply | — | Temescal CV-8 E-Beam power supply with controls[2] |
| High-vacuum pump | — | Varian VHS-6 diffusion pump for high vacuum[2] |
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