Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, ASM AD 838 L, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | AD 838 LASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Wafer Loader |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | ASM AD 838 |
| Cited variants | — | |
| Specifications | ||
| Configuration | — | 50/60 Hz[2] |
| Voltage | — | 230 Vac[2] |
| Phase | — | 1 Phase[2] |
| Power Consumption | — | 1300 w[4] |
| Wafer size | — | Wafer Loader[5] |
| Power | — | 1300 w[6] |
| Frequency | — | 50/60 Hz[7] |
| Wafer Sizes | — | 6 inch, 8 inch[1] |
| Make | — | ASM[2] |
| Model | — | AD 838 L[2] |
| Equipment type | — | Die bonder[7] |
| Vintage | — | 2015[2] |
| Wafer sizes | — | 6 in, 8 in[1] |
| Configuration note | — | Configured for single dispense; dual stamping assembly removed and stored in the bottom of the tool[7] |
| Accessory note | — | Die bonder with dispenser[8] |
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