ASM
AD 838 L
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM AD 838 L is a die bonder used in semiconductor packaging. The ASM AD 838 L G 2 variant supports 6-inch and 8-inch wafers.[1]
Wafer size
Wafer Loader
Power
50/60 Hz[2]
What it is
General reference — not yet source-verifiedDie bonders are packaging machines that place singulated semiconductor die onto a package, substrate, leadframe, or other carrier. Die bonders are used after wafer-level fabrication and dicing, and before later package interconnect and encapsulation steps.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in semiconductor assembly after die preparation and before downstream package completion. Die bonding is commonly followed by interconnect formation, encapsulation or sealing, and final package finishing and test.
Applications
General reference — not yet source-verifiedDie bonders are used in semiconductor packaging flows that require transfer of a die from wafer-derived source media onto a package element or substrate. Die bonders support assembly work where accurate die placement and controlled attachment are central to package build quality.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- The input elevator is missing the pushing device to feed workpieces from a cassette automatically.
- The input workpiece push arm is missing from the left hand side of the tool.
- One of the two archerfish dispensing modules does not work.
- The gripper needs to be leveled.
What do the numbers mean?
Power & electrical6
- 50/60 Hz[2]
Wafer handling4
- Configuration note
- Input elevator is missing the pushing device to feed workpieces from a cassette automatically[16]
Configuration & options12
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| AD 838 L G 2 | — | 2020 | Listed as a die bonder for 6-inch and 8-inch wafers; one of the two archerfish dispensing modules does not work; gripper needs to be leveled. | Equipment inventory listing[1] |
| ASM AD 838 L G 2 | — | 2020 | Supports 6-inch and 8-inch wafers; includes two archerfish dispensing modules. | Equipment inventory listing[1] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Finetech Lambda— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- MRSI HVM3— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- Kulicke & Soffa IBond 5000— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
- Hybond 572 A 40 Thermosonic Wire & Ribbon— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the AD 838 L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 838 L are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the AD 838 L are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the AD 838 L is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the AD 838 L are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the AD 838 L are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (17)Every fact above is drawn from these public sources
- [1]Equipment inventory listing — Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Inventory photo
- [10]Inventory photo
- [11]Inventory photo
- [12]Inventory photo
- [13]Inventory photo
- [14]Inventory photo
- [15]inventory listing
- [16]Equipment inventory listing — Equipment inventory listing
- [17]Equipment inventory listing — Equipment inventory listing
Last updated Oct 16, 2026.
Compare with similar tools
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The Hybond 572 A 40 is a thermosonic wire and ribbon bonder with long-reach bonding, wire and ribbon capability, and a 6 x 8.5 inch work platform.
MRSI-HVM3 is a high-precision die bonding platform for high-volume production, described by MRSI as a 3-micron class system.
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.
