Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi 2200 APM Multi-Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi 2200 |
| Specifications | ||
| Configuration | — | Non-functional spares[1] |
| Manufacturer | — | Besi[2] |
| Model | — | 2200 APM Multi-Chip[2] |
| Equipment type | — | Multi-chip die bonder[2] |
| Machine type | — | Multi-Chip Heterogeneous Die Attach Platform[3] |
| Primary application | — | SiP, MCM & hybrid modules; sequential mixed die placement on a single substrate[3] |
| Die feeding options | — | 12-inch wafers, waffle packs, Gel-Pak trays, strip feeders[3] |
| Substrate carriers | — | Ceramic carriers, PCBs, lead frames, custom carriers, wafer substrates[3] |
| Integrated process station | — | Built-in dispensing: epoxy patterning, stamping, flux dipping; compatible with multi-viscosity materials[3] |
| Bonding processes | — | Epoxy attach, soft soldering, thermocompression, eutectic bonding; hot & cold processes[3] |
| Tool changer | — | Automatic tool magazine, on-the-fly nozzle / ejector swap, no manual interruption[3] |
| Vision & compensation | — | Fiducial alignment, bad die skip; thermal compensation to minimize long-run thermal drift[3] |
| Optional upgrades | — | Additional bond heads, heated bond tools, 3D metrology, UV curing module[3] |
| Production profile | — | R&D validation, low & medium volume runs; optimized for frequent product changeovers[3] |
| Target packages | — | RF modules, sensor packages, power hybrids, optical SiP assemblies[3] |
| Vintage | — | 2001[4] |
| Serial number | — | 1000024[4] |
| Integrated functions | — | Integrated dispenser, 12-inch wafer handling, automatic tool changer, and application specific tooling[4] |
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