2200 APM Multi-Chip

Die bonders place semiconductor dice onto package substrates or carriers before later interconnection and enclosure steps. Multi-chip die bonders are used when an assembly requires more than one die on the same substrate, including combinations of conventional die attach and flip-chip style placement.

The Besi Datacon 2200 APM supports hybrid die placement within a single machine. The Besi Datacon 2200 APM sequentially attaches dice of different sizes and thicknesses onto the same substrate following programmed coordinates. The Besi Datacon 2200 APM supports face-up placement and flip-chip placement in mixed runs. The Besi Datacon 2200 APM has an integrated dispensing unit for epoxy patterning, stamping, and flux dipping. The Besi Datacon 2200 APM covers epoxy bonding, soft soldering, thermocompression, and eutectic bonding for hot and cold processes. The Besi Datacon 2200 APM has an automatic tool magazine for nozzle and ejector swaps. The Besi Datacon 2200 APM uses vision for fiducial alignment and bad-die skip, and it includes thermal compensation to reduce long-run thermal drift.^[2]

The Datacon 2200 is equipped with an integrated dispenser, 12” wafer handling, an automatic tool changer, and application specific tooling.^[4]

The Besi Datacon 2200 APM is positioned for R&D validation, low and medium volume runs, and frequent product changeovers. The Besi Datacon 2200 APM is intended to support wafer, tray, and feeder based die input together with ceramic carriers, PCBs, lead frames, custom carriers, and wafer substrates.^[2]

The Besi Datacon 2200 APM is intended for SiP, MCM, and hybrid module assembly. The Besi Datacon 2200 APM targets RF modules, sensor packages, power hybrids, and optical SiP assemblies. The Besi Datacon 2200 APM accommodates 12-inch wafers, waffle packs, Gel-Pak trays, and tape feeders. The Besi Datacon 2200 APM supports ceramic carriers, PCBs, lead frames, custom carriers, and wafer substrates.^[2]