Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Disco dad3240-dicing-saw, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | dad3240-dicing-sawDisco |
|---|---|---|
| OEM | Applied Materials | Disco |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Disco dad3240-dicing-saw |
| Specifications | ||
| vendor | — | Disco[1] |
| model | — | DFL7340[1] |
| process area | — | Packaging[1] |
| compatible materials | — | Si wafers only[1] |
| engine | — | SDE03 engine with λ = 1342 nm[1] |
| maximum sample diameter | — | 200 mm[1] |
| dicing orientation | — | Topside or backside (through tape) dicing possible[1] |
| Wafer size | — | 200mm[2] |
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