Disco
dad3240-dicing-saw
Wafer size
200mm
Optics
SDE03 engine with λ = 1342 nm[1]
What it is
General reference — not yet source-verifiedDicing saws are packaging tools that separate processed wafers into individual chips or die. Dicing saws are typically used after wafer fabrication and wafer test, when singulation is needed before die attach, packaging, or further assembly. Dicing saws are part of the back-end flow and are used to cut along predefined streets between devices.
How it works
General reference — not yet source-verifiedDicing equipment singulates wafers by following programmed streets that define the boundaries between die. Dicing systems generally rely on accurate wafer alignment, controlled motion, and a cutting or material-modification mechanism to create separation paths. The wafer is commonly supported on dicing tape during singulation so the separated die remain organized for subsequent handling.
Where it fits in the process flow
General reference — not yet source-verifiedWafer dicing sits near the end of wafer processing, after front-end device fabrication and after most wafer-level finishing steps are complete. Dicing is typically performed after thinning, backside preparation, passivation, and wafer test, depending on the product flow. The output of dicing is singulated die that move into pick-and-place, die attach, packaging, or related assembly operations.
Applications
General reference — not yet source-verifiedDicing tools are used wherever wafers must be divided into individual die for packaging or assembly. Dicing supports semiconductor devices, sensors, photonic components, and similar wafer-based products when the process flow reaches singulation. The specific dicing method is chosen according to substrate material, street design, surface condition, and integration constraints near the cut path.
- Dicing silicon wafers
What do the numbers mean?
Wafer handling2
Optics & imaging1
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What material is this dicer intended for?
It is dedicated to dicing silicon wafers only.[1]
What is the maximum wafer or sample size it handles?
The maximum sample diameter is 200 mm.[1]
Can it dice from the backside?
Yes. Backside dicing through tape is possible.[1]
What wafer surface conditions are required in the dicing streets?
The dicing streets must be smooth and mirror polished where the laser is incident, and the street area must be metal-free within a width of 0.4 times the substrate thickness centered on the dicing street.[1]
What silicon resistivity is required?
Silicon resistivity must be greater than 0.01 ohm-centimeter.[1]
Not publicly documented
The following facts about the dad3240-dicing-saw are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the dad3240-dicing-saw are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the dad3240-dicing-saw are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the dad3240-dicing-saw are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the dad3240-dicing-saw are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the dad3240-dicing-saw is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 17, 2026.
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