Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 850 LT SOI Fusion Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 850 LT SOI Fusion WaferEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 850 |
| Specifications | ||
| Configuration | — | Fully-Automatic[1] |
| Wafer size | — | Suitable for wafer sizes up to 8"/200mm wafers[1] |
| OEM | — | EV Group[2] |
| Model | — | 850 LT SOI Fusion Wafer[1] |
| Category | — | Packaging & Bonding[2] |
| Automation | — | Fully-automatic[2] |
| Cleaning module | — | One Cleaning Module[1] |
| Spinner chuck | — | One Spinner Chuck for 8”/200mm wafers[1] |
| DI water dispense line | — | One DI Water Dispense Line[1] |
| Robot / pre-aligner | — | One Genmark Robot with pre-aligner[1] |
| Low-temperature plasma activation module | — | One LowTemp Plasma Activation Module[1] |
| High-frequency RF generator | — | High Frequency RF Generator with Matching Unit[1] |
| Low-frequency RF generator | — | Low Frequency RF Generator with Matching Unit[1] |
| Control interface | — | PC controlled with windows based graphical user interface[1] |
| Access control | — | Password protected access levels[1] |
| Cleaning speed | — | Programmable rotational speed for substrate cleaning[1] |
| Configured wafer size | — | 8-inch/200mm wafers[1] |
| Plasma activation module | — | One LowTemp Plasma Activation Module[1] |
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