EV Group
850 LT SOI Fusion Wafer
The EV Group 850 LT SOI Fusion Wafer is a fully automatic wafer bonder. The EV Group 850 LT SOI Fusion Wafer is suitable for wafer sizes up to 8-inch/200mm wafers. The EV Group 850 LT SOI Fusion Wafer is currently configured for 8-inch/200mm wafers.[1][2]
What it is
How it works
The EV Group 850 LT SOI Fusion Wafer includes a cleaning module, a spinner chuck for 8-inch and 200 mm wafers, a DI water dispense line, a Genmark robot with pre-aligner, and a low temperature plasma activation module.[1][2]
The EV Group 850 LT SOI Fusion Wafer includes high frequency and low frequency RF generators with matching units, and it is PC controlled with a Windows based graphical user interface.[1][2]
Where it fits in the process flow
Applications
What do the numbers mean?
Power & electrical4
Wafer handling12
Control & software3
- PC controlled with windows based graphical user interface[1]
Configuration & options12
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the EV Group 850 LT SOI Fusion Wafer?
The EV Group 850 LT SOI Fusion Wafer is a fully automatic wafer bonder.[1][2]
What modules and handling hardware are included on the EV Group 850 LT SOI Fusion Wafer?
The EV Group 850 LT SOI Fusion Wafer includes one cleaning module, one spinner chuck for 8 inch or 200 mm wafers, one DI water dispense line, one Genmark robot with pre-aligner, and one low temperature plasma activation module.[1][2]
Not publicly documented
The following facts about the 850 LT SOI Fusion Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 850 LT SOI Fusion Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 850 LT SOI Fusion Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 850 LT SOI Fusion Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 850 LT SOI Fusion Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 850 LT SOI Fusion Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 16, 2026.
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