Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Finetech Fineplacer Lambda Sub Micron, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Fineplacer Lambda Sub MicronFinetech |
|---|---|---|
| OEM | Applied Materials | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2017 Vintage year |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Finetech Fineplacer Lambda |
| Specifications | ||
| Configuration | — | HDD and Software[1] |
| Accuracy | — | 0.5 µm[1] |
| Bonding force module | — | FD3[2] |
| Chip heating module | — | Included[2] |
| Optional dispensing module | — | FG3[1] |
| Software | — | WinFlipChip version 3.2 Revision 052[1] |
| PC | — | Included[2] |
| HDD | — | Included[1] |
| Category | — | Packaging & Bonding[2] |
| Equipment type | — | Die bonder[1] |
| Placement accuracy | — | 0.5 µm[2] |
| Dispensing module | — | Optional FG3[2] |
| HDD and Software | — | Included[1] |
| Vintage | — | 2017[1] |
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