Finetech
Fineplacer Lambda Sub Micron
The Finetech Fineplacer Lambda Sub Micron is a die bonder. The Finetech Fineplacer Lambda Sub Micron has 0.5 µm placement accuracy. The Finetech Fineplacer Lambda Sub Micron includes a bonding force module FD3 and a chip heating module.[1][2]
What it is
How it works
General reference — not yet source-verifiedDie bonders typically employ a pick-and-place mechanism with vision alignment. The Fineplacer Lambda uses a placement head that picks a die from a wafer or tray, aligns it using optical pattern recognition, and places it onto a substrate with controlled force and temperature.
The bonding force module applies controlled pressure during placement. The chip heating module can heat the die or substrate to facilitate bonding processes such as thermocompression or soldering. The dispensing module applies adhesive or flux when present.
Where it fits in the process flow
General reference — not yet source-verifiedUpstream processes include wafer backgrinding, dicing, and pick. Downstream processes include wire bonding, encapsulation, and testing.
Applications
General reference — not yet source-verifiedApplications include flip-chip bonding, chip-on-substrate assembly, multi-chip module packaging, and hybrid microelectronics assembly.
What do the numbers mean?
Vintage & configurations
- 2017Vintage year[1]
Equipment vintage year 2017
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Fineplacer Lambda Sub Micron are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Fineplacer Lambda Sub Micron are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Fineplacer Lambda Sub Micron are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Fineplacer Lambda Sub Micron are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Fineplacer Lambda Sub Micron is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Fineplacer Lambda Sub Micron are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 16, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
