Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps Bondjet BJ 820 Rotary Bond Head, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Bondjet BJ 820 Rotary Bond HeadHesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps (H&K) Bondjet BJ 820 Rotary Bond Head |
| Specifications | ||
| Configuration | — | for RF360 EPCOS[1] |
| OEM | — | Hesse & Knipps (H&K)[1] |
| Model | — | Bondjet BJ 820[1] |
| Type | — | Rotary bond head[2] |
| Category | — | Packaging & Bonding[2] |
| Configuration / option | — | For RF360 EPCOS[2] |
| Bonding modes | — | Round wire and deep access ribbon and wire bonding[3] |
| Reported speed | — | Up to 7 wires/sec[3] |
| Work area | — | 12 in x 16.1 in[3] |
| Footprint | — | 720 x 1250 mm[3] |
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