Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Nordson Stellar 4000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Stellar 4000Nordson |
|---|---|---|
| OEM | Applied Materials | Nordson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Nordson Stellar 4000 |
| Specifications | ||
| Configuration | — | Single Phase[1] |
| Power | — | 240 W[1] |
| Full load Current | — | 3 A[1] |
| Manufacturer | — | Nordson / Dage[1] |
| Model | — | Stellar 4000[1] |
| Equipment type | — | Bond tester[1] |
| Operation | — | Manually operated production bond testing[2] |
| Test modes | — | Wire pull, ball shear, die shear, bump pull, tweezer pull[2] |
| Power supply | — | 100-240 VAC, single-phase[3] |
| Frequency | — | 50-60 Hz[1] |
| Force measurement principle | — | Electro-mechanical load cell with frictionless transduction[3] |
| Positioning accuracy | — | ±1 µm[3] |
| System force accuracy | — | ±0.25 % FS[3] |
| XYZ travel range | — | 100 mm × 100 mm × 65 mm[3] |
| XY speed | — | Up to 2 mm/s[3] |
| XY resolution | — | 500 nm[3] |
| Footprint | — | 705 mm × 562 mm × 675 mm[3] |
| Weight | — | 86 kg[3] |
| PC connection | — | Ethernet[4] |
| Software | — | Paragon Lite[4] |
| Illumination | — | Software dimmable LED[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →