Stellar 4000

Bond testers are packaging and assembly test systems used to measure the mechanical strength of interconnects and attached structures after bonding steps. Bond testers are used to verify whether a bond fails within expected limits under controlled pull or shear loading.

The Stellar 4000 applies pull or shear test methods through interchangeable test configurations that cover bond wire pull, ball shear, die shear, bump pull, and tweezer pull. The Stellar 4000 uses frictionless load cartridge technology for accuracy, repeatability, and correlation. The Stellar 4000 has step back accuracy of ± 1 µm, system accuracy of ± 0.25 % FSL, axis travel of 100 mm × 100 mm × 65 mm, XY speed up to 2 mm/s with 500 nm resolution, and Z speed of 5 mm/s with 250 nm resolution. The Stellar 4000 has an integrated and enclosed table design, Ethernet PC connection, software-dimmable LED illumination, and a pneumatic safety function for tool protection and air warning.^[4][2]

Bond testing sits after interconnect formation or die attach in assembly flows and before final release of packaged devices. Bond testing is used as a process control and quality step to check whether packaging operations are producing mechanically sound joins.

Bond testers are used across semiconductor packaging and related microelectronic assembly work where bonded wires, bumps, and attached die must be mechanically verified. Bond testers support qualification work, routine process monitoring, and failure analysis by revealing how and where bonded structures separate under load.