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Comparison ledger

0041-26723 Bonded Assemblyversus4 KE

Applied Materials 0041-26723 Bonded Assembly, West Bond 4 KE, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
4 KEWest Bond
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyWest Bond 4 KE
Specifications
Bond Force Range—10 – 150 grams[1]
Voltage—115V, 50/60Hz, 3.2A[1]
Machine type—Wire bonder[2]
Electrical requirements—115V, 50/60Hz, 3.2A[1]
Machine family—4KE / 4KEH[3]
Bonder type—Multi-Loop, Multi Wire, Wedge / Ball / Ribbon Wire Bonder[3]
Axes—Motorized Z and Y Axes[3]
Convertible modes—3-Way Convertible[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]web.archive.orgweb.archive.org