4 KE

The West Bond 4 KE is a semi-automatic wire bonder used in semiconductor packaging and assembly. The machine is designed for multi-loop, multi-wire, and three-way convertible bonding, supporting wedge, ball, and ribbon bonding methods.^[3]

The 4 KE has a bond force range of 10 to 150 grams and operates on 115 V at 50 or 60 Hz with a current draw of 3.2 A.^[1]

The West Bond 4 KE uses microprocessor-controlled motors to drive both the Y and Z axes, enabling a series of parallel, single or multiple arched wires with identical loop and bond shapes. The machine employs a throat-less chassis and micromanipulator design that places all components above the horizontal bond plane, eliminating restrictions on package size or shape.^[3]

The tool head is convertible between 45-degree wedge bonding, 90-degree feed for wire and ribbon, and ball bonding. A simple exchange of clamp assemblies, bond tool, and wire path, along with the appropriate software mode, allows switching between conventional 45-degree wire feed, deep access wire or ribbon, ball bonding, insulated wire, and single-point tab or lead bonding. All programmed bond variables and machine settings for each bond mode are retained in memory between conversions.^[3]

Wire bonders such as the West Bond 4 KE are used in the semiconductor assembly process after die attachment and before encapsulation. The machine creates electrical connections between the integrated circuit's bond pads and the package leads using fine wire.

The West Bond 4 KE is intended for bonding high-power and high-frequency devices where identical bond and loop shapes are critical. Applications include microwave devices, semiconductors, RF products, and hybrid circuits.^[3]