Waferpedia

Comparison ledger

0041-39086 ESC Partversus901e

Applied Materials 0041-39086 ESC Part, Tegal 901e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
901eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—75 mm to 150 mm round substrates; rectangular substrates from 100 mm to 125 mm on a side
Process node—down to 0.5 micron
Introduced—2000
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—900 Series
Family—Tegal 901e
Specifications
Type—diode plasma etcher[1]
Fixed electrode gap—38 mm[1]
Round substrate handling—75 mm to 150 mm round silicon and GaAs substrates[1]
Rectangular substrate handling—rectangular substrates from 100 mm to 125 mm on a side[1]
Design-rule suitability—best suited for technology design rules down to 0.5 micron[1]
Electrode gap—38 mm fixed[1]
Round substrate size—75 mm to 150 mm[1]
Rectangular substrate size—100 mm to 125 mm on a side[1]
Best suited design rules—Down to 0.5 micron[1]
Wafer size—Wafer Size Range[2]
Phase—Power Requirements 230 V 16.0 A 50/60 Hz 1 Phase[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]dealer listingwotol.com